Green High

Green advanced epoxy molding compound sought after by the market?? Recently said that the world semiconductor packaging epoxy molding compounds (EMC / Epoxy Molding Compound) or epoxy molding compound), the mid 60s of last century originated in the United States (Hysol), after carried forward in Japan, now China has become the world’s rapidly rising EMC manufacturing country. EMC 2006 global demand is expected in 16 to 17 million tons, demand in China EMC may 4 tons, consumer demand in these high-end epoxy molding compound in green is a hot topic?? High-end epoxy molding material lot of hype. China EMC specific situation in manufacturing industry? Explained that the end of 2006, total production capacity in China EMC total of about 70,000 tons / year, in which Henkel Huawei Electronics Co., Ltd., Sumitomo Bakelite Co., Ltd. in Suzhou, Changchun Feng Plastic (Changshu) Co., Ltd. Changxing Electronic Materials ( Kunshan) Co., Ltd., Hitachi Chemical Industry (Suzhou) Co., Ltd., five major manufacturers together for the 60,000 tons / year, accounting for 86% of total production capacity, other manufacturers can produce about 10,000 tons / year, accounting for 14% of total production capacity.

    EMC is expected by the end of 2008 China’s total capacity to more than 80,000 tons / year. 2006 EMC Packaging in China about 40,000 tons of total use in mainland China companies account for about 7 percent, about 3 percent of overseas imports of EMC, the growth rate of about 20% of the next few years. According to reports, in 2005 Henkel Huawei Electronics Co., Ltd. through a joint venture to integrate the United States and the former Hysol Electronic Co., Ltd. Jiangsu CLP Warwick resources, has become the world’s three largest manufacturers of EMC, global marketing and Hysol Hysol-Huawei this 2 big brand EMC, changed the world semiconductor industry competition pattern EMC; in 2006 Henkel Huawei Electronics Co., Ltd. to undertake the Hysol brand Transferring EMC, have been exported in large quantities overseas, with strong international competitiveness, as U.S. factories EMC Hysol products in 2007 will be fully transferred to Henkel Huawei Electronics Co., Ltd. factory and actively develop the overseas market and speed up other companies to expand overseas market, EMC Chinese-made exports will increase rapidly, China is expected to become the world’s semiconductor EMC lead largest producer, China is expected EMC has become the world’s No. 2 producer of large capacity.

    Domestic R & D already has a strength, main features are: small number of institutions, relying on research institutes, domestic and foreign investments simultaneously. According to reports, the current professional R & D institutions are: domestic Henkel Huawei Electronics Co., Ltd. of Jiangsu Province, IC packaging materials Engineering Research Center, Beijing Microelectronics Co., Ltd. Relying on the first Section of the Chinese Academy of Sciences Chemistry; foreign investment in Suzhou Sumitomo Electric Wood Co., Ltd. Hitachi Chemical Industry (Suzhou) Co., Ltd.; Taiwanese Changxing Electronics Materials (Kunshan) Co., Ltd. R & D centers overseas, and other domestic companies are no EMC professional R & D institutions. This R & D structure determines the new product development and launch, and the supply of advanced packaging with EMC, remains dominated by foreign capital or import grid. Currently SOT, SSOP, TSOP, QFP, TQFP and other advanced packaging used in EMC, the Henkel Huawei Electronics Co., Ltd., Suzhou Sumitomo Bakelite Co., Ltd., Hitachi Chemical Industry (in Suzhou) Co., Ltd., a large-scale production, and has in a large number of domestic enterprises to use foreign package, dominant; Changxing Electronic Materials (Kunshan) Co., Ltd. and Beijing’s first Division of Microelectronics, also promote the development of new products now.

    Sumitomo Bakelite Co., Ltd. Suzhou IC package mainly high-end products are the main, dominant; Henkel Huawei Electronics Co., 1 the total sales volume, sales of high-grade EMC 2, with most of China’s packaging industry’s need for high , in low-end epoxy molding compound, product line complete. Henkel Huawei Electronics Co., Ltd. currently produced SSOP, TQFP, QFN, BGA and other advanced packaging used EMC reached the international advanced level and has been fully recognized in the market, production and sales expanded rapidly. According to reports, the international EMC to epoxy resin system is divided into: ECON, DCPD, Bi-Pheny1 and Multi-Function type, etc. The main products in the domestic capital for SMEs focused ECON epoxy resin system EMC, applies to a wide range of large Chinese diodes, transistors and other common packages for SMEs, but there is a low degree of brand recognition, product consistency is poor, weak technology issues need to be resolved, and the EMC requirements 5 -10 low temperature refrigerated transport and storage, resulting in high logistics cost, thereby limiting the lack of resources, small-scale domestic small and medium manufacturers expand the national market, usually in the local area market to low-price competition. MCM (MCP), FBP, BGA, CSP, MEMS, SiP and other advanced packaging with EMC is still the main imports, local manufacture of EMC also promote testing and certification process on the volume.

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